View HLMP-HM63-Y30XX_4152515.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

HLMP-HG63, HLMP-HM63, HLMP-HB63
Precision Optical Performance Red, Green and Blue New 5mm Standard Oval LEDs
Data Sheet
Description
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight.
Features
* Well defined spatial radiation pattern * High brightness material * Available in red, green and blue color. Red AlInGaP 626nm Green InGaN 525nm Blue InGaN 470nm * Superior resistance to moisture * Standoff Package * Tinted and diffused * Typical viewing angle 40 x100
Applications
* Full color signs
Package Dimensions
Notes: All dimensions in millimeters (inches). Tolerance is 0.20mm unless other specified
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Device Selection Guide
Part Number HLMP-HG63-TX0xx HLMP-HM63-Y30XX HLMP-HB63-QU0xx Color and Dominant Wavelength ld (nm) Typ Red 66 Green 55 Blue 470 Luminous Intensity Iv (mcd) at 20 mA-Min 800 990 460 Luminous Intensity Iv (mcd) at 20 mA-Max 990 5040 50
Tolerance for each intensity limit is 15%. Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package.
Part Numbering System
HLMP- H x 63 - x x x x x Packaging Option ZZ: Flexi Ammopacks DD: Ammopack Color Bin Selection 0: Open distribution Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide. Color B: Blue 470 G: Red 626 M: Green 525 Package H: 5mm Standard Oval 40 x100
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Ratings, TA = 25C
Parameter DC Forward Current [] Peak Forward Current Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range Red 50 00 [] 0 5 (IR = 00 A) 30 -40 to +00 -40 to +0 Blue and Green 30 00 [3, 4] 5 (IR = 0 A) 0 -40 to +85 -40 to +00 Unit mA mA mW V C C C
Notes: 1. Derate linearly as shown in Figure 4 and Figure 8. 2. Duty Factor 30%, frequency 1kHz. 3. Duty Factor 10%, frequency 1KHz. 4. For long term performance with minimal light output degradation, drive current below 15mA is recommended for Blue LED.
Electrical / Optical Characteristics, TA = 25C
Parameter Forward Voltage Red Green Blue Reverse Voltage Red Green & blue Dominant Wavelength [] Red Green Blue Peak Wavelength Red Green Blue Thermal Resistance Luminous Efficacy [] Red Green Blue Luminous Flux Red Green Blue Luminous Efficiency [3] Red Green Blue Symbol Min. .8 .7 .7 5 5 60 50 460 66 55 470 634 56 464 40 630 540 480 Typ. . 3. 3. Max. .4 3.7 3.7 Units Test Conditions
VF
V
IF = 0 mA
VR
V
IR = 00 mA IR = 0 mA
IF = 0 mA
lPEAK RqJ-PIN
nm C/W
Peak of Wavelength of Spectral Distribution at IF = 0 mA LED Junction-to pin
hV
50 530 65 700 3700 990 40 60 6
lm/W
Emitted Luminous Power/Emitted Radiant Power
jV
mlm
IF = 0 mA
he
lm/W
Luminous Flux/Electrical Power IF = 0 mA
Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/hV where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 3. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
3
AlInGaP Red
1.0 0.8 0.6 0.4 0.2 0.0 550 FORWARD CURRENT - mA 600 650 700 RELATIVE INTENSITY 50 40 30 20 10 0
0
1
2
3
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 1. Relative Intensity vs Wavelength
2.5 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2 1.5 1 0.5 0
Figure 2. Maximum Forward Current vs Ambient Temperature
55 50 I F - FORWARD CURRENT - mA 45 40 35 30 25 20 15 10 5 0
0
10
20
30
40
50
0
20
DC FORWARD CURRENT - mA
40 60 80 100 TA - AMBIENT TEMPERATURE - C
120
Figure 3. Forward Current vs Forward Voltage
Figure 4. Relative Intensity vs Forward Current
4
InGaN Blue and Green
1.0 0.9 0.8 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 530 WAVELENGTH - nm 580 630 FORWARD CURRENT - mA Blue Green
35 30 25 20 15 10 5 0 0 1 2 3 FORWARD VOLTAGE - V 4
Figure 5. Relative Intensity vs Wavelength
1.6 1.2 1 0.8 0.6 0.4 0.2 0 0 5 Blue 10 15 20 25 FORWARD CURRENT - mA 30 Green
Figure 6. Forward Current vs Forward Voltage
35 IF max. - MAXIMUM FORWARD CURRENT - mA 30 25 20 15 10 5 0 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE - C
RELATIVE LUMINOUS INTENSITY - NORMALIZED AT 20mA
1.4
Figure 7. Relative Intensity vs Forward Current
Figure 8. Maximum Forward Current vs Ambient Temperature
DOMINANT WAVELENGTH SHIFT- nm
7 6 5 4 3 2 1 0 -1 -2 -3 FORWARD CURRENT - mA 0 5 10 15 20 25 30 35 Green Blue
Figure 9. Relative dominant wavelength vs Forward Current
5
1 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Radiation pattern-Major Axis
1 0.9 NORMALIZED INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
Figure 11. Radiation pattern-Minor Axis
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA Bin P Q R S T U V W X Y Z 1 2 3 Min 380 460 550 660 800 960 1150 1380 1660 1990 2400 2900 3500 4200 Max 460 550 660 800 960 1150 1380 1660 1990 2400 2900 3500 4200 5040
VF Bin Table (V at 20mA)
Bin ID VD VA VB Min .8 .0 . Max .0 . .4
Notes: 1. Tolerance for each bin limit is 0.05V. 2. VF binning only applicable to Red color.
Tolerance for each bin limit is 15%
6
Red Color Range
Min Dom 60 Max Dom 630 Xmin 0.6904 0.676
Tolerance for each bin limit is 0.5nm.
Ymin 0.3094 0.306
Xmax 0.689 0.708
Ymax 0.943 0.9
Green Color Bin Table
Bin 3 4 5 Min Dom 50.0 54.0 58.0 53.0 536.0 Max Dom 54.0 58.0 53.0 536.0 540.0 Xmin 0.0743 0.650 0.060 0.856 0.387 0.068 0.70 0.73 0.003 0.469
Tolerance for each bin limit is 0.5nm
Ymin 0.8338 0.6586 0.89 0.6556 0.848 0.6463 0.7965 0.6344 0.7764 0.63
Xmax 0.856 0.060 0.068 0.387 0.73 0.70 0.469 0.003 0.659 0.96
Ymax 0.6556 0.89 0.6463 0.848 0.6344 0.7965 0.63 0.7764 0.6070 0.7543
Blue Color Bin Table
Bin 3 4 5 Min Dom 460.0 464.0 468.0 47.0 476.0 Max Dom 464.0 468.0 47.0 476.0 480.0 Xmin 0.440 0.88 0.374 0.766 0.9 0.699 0.87 0.66 0.063 0.57 Ymin 0.097 0.0904 0.0374 0.0966 0.0495 0.06 0.067 0.09 0.0945 0.43 Xmax 0.766 0.374 0.699 0.9 0.66 0.87 0.57 0.063 0.397 0.093 Ymax 0.0966 0.0374 0.06 0.0495 0.09 0.067 0.43 0.0945 0.78 0.37
Tolerance for each bin limit is 0.5nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information.
7
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800 Green 0.600 Y 123 4 5
0.400 Red 0.200 5 4 Blue 2 3 1 0.100 0.200 0.300 0.400 X 0.500 0.600 0.700 0.800
0.000 0.000
Relative Light Output vs Junction Temperature
10
RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25C)
GREEN 1
BLUE
RED
0.1 -40
-20
0
20
40
60
80
100
120
TJ - JUNCTION TEMPERATURE - C
8
Precautions:
Lead Forming:
* The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink.
Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination.
Avago Technologies LED configuration
Soldering and Handling:
* Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED.
1.59mm
Anode
Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste.
* Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process.
Note: In order to further assist customer in designing jig accurately that fit Avago Technologies' product, 3D model of the product is available upon request.
* ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition: Wave Soldering [1, 2] Pre-heat temperature Preheat time Peak temperature Dwell time 05 C Max. 60 sec Max 50 C Max. 3 sec Max. Manual Solder Dipping 60 C Max. 5 sec Max
* At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size 0.45 x 0.45 mm (0.08x 0.08 inch) 0.50 x 0.50 mm (0.00x 0.00 inch) Diagonal 0.636 mm (0.05 inch) 0.707 mm (0.08 inch) Plated through hole diameter 0.98 to .08 mm (0.039 to 0.043 inch) .05 to .5 mm (0.04 to 0.045 inch)
Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.
* Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 9
* Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE
Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux
200
Solder bath temperature: 245C 5C (maximum peak temperature = 250C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.
150
100
50 PREHEAT
0
10
20
30
40
50 60 TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394)
CATHODE
20.5 1.00 (0.8071 0.0394)
9.125 0.625 (0.3593 0.025) 18.00 0.50 (0.7087 0.0197)
12.70 0.30 (0.50 0.0118) 0.70 0.20 (0.0276 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES).
A VIEW A-A
A
4.00 0.20 TYP. (0.1575 0.0079)
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff
0
Packaging Box for Ammo Packs
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number (1T) Lot: Lot Number LPN (9D) MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID
STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity CAT: Intensity Bin BIN: Refer to below information REV: DeptID:
Made In: Country of Origin
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date C/O: Country of Origin Customer P/N: Supplier Code: CAT: Intensity Bin BIN: Refer to below information DATECODE: Date Code QUANTITY: Packing Quantity
Acronyms and Definition:
BIN: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin)
Example:
(i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin "VB" 2: Color bin 2 only
DISCLAIMER AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. AV0-0530EN - June 6, 007

▲Up To Search▲

Price & Availability of HLMP-HM63-Y30XX

	To Download HLMP-HM63-Y30XX Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .